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> StyleLine Phono interconnect


3 Articulation Poles.

The StyleLine Phono interface showcases MIT's breakthrough miniaturization technology with its MPC connector. MIT is able to construct Multipole networks on a wafer so small they fit inside an RCA connector! Measurements in our labs have shown consistently excellent results, allowing this new generation of surface-mounted parts to focus energy. The result is dimensional, natural and without blurring.

Features & Benefits:

Multipole Technology
wafered within our MPC connectors results in better bass, better midrange and smoother highs.

Quanti-Shield Technology
QST provides 98% RFI noise rejection and chassis-to-chassis ground circuits create a “black background” for audio.


>  StyleLine Phono documenten

> Prijslijst MIT Interrconnect Phono
> Brochure Download



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